How are Integrated Circuits produced?

Wafer manufacturing and chip manufacturing are two steps to make integrated circuits. Wafer manufacturing includes two major steps, ingot manufacturing, and wafer manufacturing. It can be subdivided into the following main processes: polysilicon-single crystal silicon-ingot growth-ingot cutting and inspection-outer diameter grinding --Slicing-Round edge-Surface grinding-Etching-Flaw removal-Polishing- (Epitaxial-Etching-Flaw removal) -Cleaning-Inspection-Packaging. The chip manufacturing can be roughly divided into several steps: Wafer Fabrication, Wafer Probe, Packaging, Initial Test and Final Test and other steps.