SAPPHIRE WAFER CLEANING EQUIPMENT

https://www.cryscore.com/sapphire-wafer-cleaning-equipment.html

Ultrasonic cleaning machine
Ultrasonic cleaning machine is a kind of cleaning equipment widely used in the microelectronics industry. The principle of ultrasonic cleaning is that under the strong ultrasonic effect (the commonly used ultrasonic frequency is 20-40khz), the inside of the cleaning agent will produce sparse and dense parts, and the sparse part will produce nearly vacuum cavity. When the cavity disappears, strong local pressure will be generated nearby, it breaks the chemical bond in the molecule and desorbs the impurities on the surface of the sapphire wafer. When the ultrasonic frequency and the vibration frequency of the cavity resonate, the mechanical force reaches the maximum, and a large amount of heat energy accumulates in the bubble, which makes the temperature rise and promotes the occurrence of the chemical reaction. The improvement of ultrasonic power is helpful to promote the cleaning effect. Because the removal effect of the ultrasonic cleaning machine for small particles less than 1 μm is not ideal, the ultrasonic cleaning machine is mostly used to remove large contaminated particles attached to the surface of the sapphire wafer.